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Go Back   GSM-Forum > GSM & CDMA Phones / Tablets Software & Hardware Area > Nokia > Nokia Hardware & Hardware Repair


Nokia Hardware & Hardware Repair all what you need for Hardware Repairing for Nokia Phones. Before writing any thread here try to check the Frequently Asked Questions Section.

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Old 07-05-2003, 21:09   #1 (permalink)
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Removing UEM


Hi every one
I like to remove the UEM but i can't i heat it by the hot air but no way ,,,is there any Procedure or way to remove it please help me
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Old 07-05-2003, 23:59   #2 (permalink)
legija
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If it's glued, you can't remove it.
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Old 07-06-2003, 09:36   #3 (permalink)
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in only 8310/6510 and a few other models u have UEM without glue..rest have glue around them so forget them but the ones without glue u can remove by using a hot air gun like the ones from Steinel or black&decker...

WBR
Syed
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Old 07-06-2003, 10:28   #4 (permalink)
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it is possible to remove it.....if you dont believe, I can make some photos of my work
Wolf.
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Old 07-06-2003, 15:40   #5 (permalink)
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@ GSMWolf

Hello GSMWolf.

I want to see your photos.

B.R.
Nokx
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Old 07-06-2003, 16:09   #6 (permalink)
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Talking

yeah...GSMWOlf...right..
We all can open it..although with Glue...,
Rehot it (in 30-60Second) ,the LEAD/TIN will push out....after that pull the small hole with tweezers or any tool usually u use (place of Lead or TIN push out) , pull with very very carefully....if u pull with suddenly...it will broke the line of pcb under the IC,,ofcousre with hot air also still in position in the up of IC.
Try it with carefully....
If u want to try...
try it first with obsolete PCB...IC with glue....
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Old 07-06-2003, 17:08   #7 (permalink)
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yes this works exactly as j2000 described it.....

Syed
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Old 07-06-2003, 20:59   #8 (permalink)
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i'm waiting to for this pictures gsmwolf...
(i think video is beter....)
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Old 07-06-2003, 21:55   #9 (permalink)
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Thanks

Thanks Gueys for yoyr Help and i need the Pictures please(GSMWolf)
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Old 07-06-2003, 22:16   #10 (permalink)
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Quote:
Originally posted by j2000
yeah...GSMWOlf...right..
We all can open it..although with Glue...,
Rehot it (in 30-60Second) ,the LEAD/TIN will push out....after that pull the small hole with tweezers or any tool usually u use (place of Lead or TIN push out) , pull with very very carefully....if u pull with suddenly...it will broke the line of pcb under the IC,,ofcousre with hot air also still in position in the up of IC.
Try it with carefully....
If u want to try...
try it first with obsolete PCB...IC with glue....

thaaaanx man............it is work i tested
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Old 07-07-2003, 11:39   #11 (permalink)
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Unhappy MY Mobile did

Hi Dear
I Remove it it's take time but after that fix the new UEM but my mobile did

What can i do please help me
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Old 07-07-2003, 11:56   #12 (permalink)
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@ mogh

After change UEM, you must write Imei and Simlock data.

Is the new UEM 100% okay?

B.R.
Nokx
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Old 07-07-2003, 13:41   #13 (permalink)
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hi

I think befor i write the Imei number i have to power on the mobile and i have to check if it give me imei ????????..or not
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Old 07-07-2003, 14:36   #14 (permalink)
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After replacing the UEM and before updating the Imei you should at least see text on the screen ie "test mode" etc. If you cannot and you believe the rest of the phone is ok then the UEM you have fitted is faulty (there are many faulty/bad UEM's). Or you have not fitted the UEM correctly and could have gicven the IC too much heat.

Be careful of bad IC's this seems to be the most common reason in my area for UEM's not working. I have seen many UEM sealed as brand new in packaging yet they have a high failure rate. Some I have seen have only one IC in 6 that works.
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Old 07-07-2003, 17:38   #15 (permalink)
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Wink Best way to soldering BGA in PCB.

This way i usually use to place new one Sensitive BGA IC:
1:Give Flux on PCB and under BGA IC,

2:Put BGA ic in right position...,after that....

3:Rehot PCB under BGA around 15-40 second,with seting in Hot air around 280-310 degree (distance 2-3cm from PCB),till we see little smoke of flux ,sample:if we want place new one cobba in 3310..rehot with hot air firstly in under cobba pcb,i mean "LCD Side" right under cobba around 15-40 second.

4:After that..quiclkly move the Hot Air to up or on top of BGA IC...,in 5-10second BGA BALL will quickly be liquid to PCB.

I use it in many2x BGA in case very Sensitive like CPU X35 , COBBA and etc..

Try it.,...
I hope it will help for replacing Sensitive Cobba.
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