solution for 8250/8xxx hanging problem - GSM-Forum

remle · 03-06-2002, 23:46

Hi,

Problems such as hanging , shut off and resets on 8xxxx specially the 8250 are caused by dry joints under the MAD and CCONT ic. Reflow can solve the prob but what if these ic are underfilled? You kill the phone permanently.

The way to reflow these glued ics is to heat the board a little below the solder melting point , 300 degrees approx for about 4 hours. This is to be sure air bubbles inside the glue have escaped. Then increase the temp to the right level, 360 degrees approx to melt and refresh the joints.

Hope this help solve your nightmares.

b.r.
remle

P.S.

Patience is a virtue

pali · 04-04-2002, 16:38

@remle

Are you crazy ??
Flowing hot air on BGA and PCB for 4Hours?? with 300'C?
If you read service manual, component handling ..
BGA's are about 270'C but for 30 seconds.

b.r.

Pali

daytona · 04-05-2002, 03:53

The guy is probably talking thru his nose! The method he prescribe is for use by other similar insane idiots. If remle does not have a valid solution, it's better to just not post anything rather than help a newbie fry a phone!

Write to me for a valid solution!

hanoon · 04-05-2002, 10:06

i think to leave it hanging better than to leave it under hot air for 4 hours

Hanukkah · 04-06-2002, 16:40

Maybe what remle meant was not via the use of hot air rework station. But oven heating the board. Anyway, it might work... but not for 4 hours... the plastic parts are just going to melt. Besides the hanging is not from CCONT or MAD. Check previous threads... regarding solution

tra0416 · 04-06-2002, 19:16

maybe in degree F not C.

if its totally glued, it surely bubble.

sloba · 04-07-2002, 06:11

sucessfully removed mad that is glued.try to do a litlle practice on some dead boards.you`ll see that is possible.just did it on 8250(price for this kind of repair cca 100 EUR)

remle · 04-07-2002, 13:05

Hi ,

Why not test this method on dead phones and find out if the solder bubbles. Anyway you can replace any underfilled ic.
This is my method of repairing. Upgrading sometimes even kill the phone and solutions from nokia about this problem is no good.

Best regards,

remle

03-06-2002, 23:46	#1 (permalink)
remle Freak Poster Join Date: Nov 1999 Posts: 99 Member: 683 Status: Offline Thanks Meter: 0	solution for 8250/8xxx hanging problem Hi, Problems such as hanging , shut off and resets on 8xxxx specially the 8250 are caused by dry joints under the MAD and CCONT ic. Reflow can solve the prob but what if these ic are underfilled? You kill the phone permanently. The way to reflow these glued ics is to heat the board a little below the solder melting point , 300 degrees approx for about 4 hours. This is to be sure air bubbles inside the glue have escaped. Then increase the temp to the right level, 360 degrees approx to melt and refresh the joints. Hope this help solve your nightmares. b.r. remle P.S. Patience is a virtue

04-05-2002, 10:06	#4 (permalink)
hanoon No Life Poster Join Date: Dec 2001 Location: USA Age: 45 Posts: 596 Member: 8051 Status: Offline Thanks Meter: 6	hanoon© i think to leave it hanging better than to leave it under hot air for 4 hours

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04-04-2002, 16:38	#2 (permalink)
pali No Life Poster Join Date: Nov 2001 Location: Slovakia Posts: 1,005 Member: 7586 Status: Offline Thanks Meter: 11	@remle Are you crazy ?? Flowing hot air on BGA and PCB for 4Hours?? with 300'C? If you read service manual, component handling .. BGA's are about 270'C but for 30 seconds. b.r. Pali

04-05-2002, 03:53	#3 (permalink)
daytona Freak Poster Join Date: Jul 2001 Location: Malaysia Posts: 252 Member: 5381 Status: Offline Thanks Meter: 0	The guy is probably talking thru his nose! The method he prescribe is for use by other similar insane idiots. If remle does not have a valid solution, it's better to just not post anything rather than help a newbie fry a phone! Write to me for a valid solution!

04-06-2002, 16:40	#5 (permalink)
Hanukkah No Life Poster Join Date: Jul 2001 Location: RP Age: 48 Posts: 890 Member: 5246 Status: Offline Thanks Meter: 9	Maybe what remle meant was not via the use of hot air rework station. But oven heating the board. Anyway, it might work... but not for 4 hours... the plastic parts are just going to melt. Besides the hanging is not from CCONT or MAD. Check previous threads... regarding solution

04-06-2002, 19:16	#6 (permalink)
tra0416 Insane Poster Join Date: Sep 2001 Location: Philippines Posts: 79 Member: 6460 Status: Offline Thanks Meter: 1	maybe in degree F not C. if its totally glued, it surely bubble.

04-07-2002, 06:11	#7 (permalink)
sloba Freak Poster Join Date: Nov 1999 Location: Serbia Age: 52 Posts: 274 Member: 685 Status: Offline Thanks Meter: 23	sucessfully removed mad that is glued.try to do a litlle practice on some dead boards.you`ll see that is possible.just did it on 8250(price for this kind of repair cca 100 EUR)

04-07-2002, 13:05	#8 (permalink)
remle Freak Poster Join Date: Nov 1999 Posts: 99 Member: 683 Status: Offline Thanks Meter: 0	Hi , Why not test this method on dead phones and find out if the solder bubbles. Anyway you can replace any underfilled ic. This is my method of repairing. Upgrading sometimes even kill the phone and solutions from nokia about this problem is no good. Best regards, remle