[BalfourCellular]

firstly patience is what will get this job done right. if you are impatient you will without a doubt kill the phone.

heat up the old / broken bga do not pull on it it will work itself loose. tap the side if it when it moves its time to remove. keep the air on it dont put you iron down then try remove it you will rip the pads off.

make sure that you have taken note of the way it was put on. once off use good quality flux and a good quality iron, work quick. apply flux to the pads on the boad use quite a bit, go over all the pads make sure that all the pads are there. use a magnifying glass if you have, to.

im taking it for granted that you will be usuing a old replacement part, so turn overr the ic that you will be putting on, apply plenty flux use your irion and take off all excess solder so both the board and the bga are de-balled.

if you have patience now you wont have to re-ball them.

turn the heat down on your iron about 300 works for me aplly plenty flux tho the pads on the board. slighty tin the tip on your iron. and lighly run over the pads. then do the same to th ic.

place and re align the ic back on the board / again using flux. (tip the oily yellow flux) dosnt work so well but the water soluble clear flux does.

put your hot air station on about 300 with the air tuned to the lowest. anything higher will **** the ic clean off the board. SLOWLY heat up the ic once you see (flux)smoke from the ic and you also notice the ic is sliding into the correct position.

increase the air and heat pressure. the air plus the heat will seat the ic properly. DO NOT EVER EVER put you blade or scalpel ontop ofthe ic and place pressure as this will short out the pads below.

patience is your frien in this case

enjoy

kazman
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kaz Varkel
T1/Lvl 5 Nokia SA