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Go Back   GSM-Forum > GSM & CDMA Phones Hardware Repair Area > Hardware Equipments for GSM > RE-7500 Reworking System & iSolder


RE-7500 Reworking System & iSolder the Infrared Reworking System - Product By Jovy Systems. & iSolder the intelligent soldering machine

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Old 07-05-2010, 15:43   #16 (permalink)
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It is very true the XY table is hopeless. I am trying to reflow Hp pavilion dv 9000 board & no way can I get it to stay on the stand. Is there a stand you can recommend. I am also getting pop-corning & delamination. I read, this is due to moisture hold on bga. Does pop-corning damage the bga or the board. Any advise will be highly appreciated. Another thing is there a profile for Hp pavilion DV2000-6000-9000 boards please.
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Old 07-05-2010, 15:46   #17 (permalink)
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Originally Posted by pentu View Post
Happy to know that profile worked for you, jovy is a entry level rework machine mastering it takes lot of time, normally lead free bga should melt at 215C but check with your jovy machine how much the temp spikes after the profile is completed then adjust the profile setting for the rework, normally dont go by the laser pointer in the jovy for placing the pcb and the bga for rework, check with a small match stick for the centre of the ir element to place the bga underneath and also i have faced problem of placing the pcb in proper level on jovy x,y table because jovy supplied pcb holder is not professional.
It is very true the XY table is hopeless. I am trying to reflow Hp pavilion dv 9000 board & no way can I get it to stay on the stand. Is there a stand you can recommend. I am also getting pop-corning & delamination. I read, this is due to moisture hold on bga. Does pop-corning damage the bga or the board. Any advise will be highly appreciated. Another thing is there a profile for Hp pavilion DV2000-6000-9000 boards please.
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Old 07-05-2010, 17:26   #18 (permalink)
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Quote:
Originally Posted by bhartek View Post
It is very true the XY table is hopeless. I am trying to reflow Hp pavilion dv 9000 board & no way can I get it to stay on the stand. Is there a stand you can recommend. I am also getting pop-corning & delamination. I read, this is due to moisture hold on bga. Does pop-corning damage the bga or the board. Any advise will be highly appreciated. Another thing is there a profile for Hp pavilion DV2000-6000-9000 boards please.
check the height of the top heater. the profile i mentioned previously is what i use for Dv2000/3000/6000/9000 boards. pop corn effect is for moisture also and also few boards are reflowed again and again the thermal stress on the board and bga is very high. pop corn effect on bga and also on board either of it cannot be reused. place the thermal sensor very near to the bga, apply flux to the tip of the sensor before placing, use a good quality white light torch to do visual inspection of bga when the temperature reaches 210c once the temp reaches 215c the solder balls should start shining, if you are just reflowing allow the temp extra 3c from the solder balls shining, if you are removing the bga ic allow temp to go extra 4c-5c depending on the requirement and also when the temperature reaches 215c tap all the four corners of x,y table (not on motherboard) very very mildly using a very small metal piece this will release surface tension on the board and bga and while removing bga you can avoid bga pads coming off and avoiding junking the motherboard
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Old 07-05-2010, 23:00   #19 (permalink)
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Quote:
Originally Posted by pentu View Post
check the height of the top heater. the profile i mentioned previously is what i use for Dv2000/3000/6000/9000 boards. pop corn effect is for moisture also and also few boards are reflowed again and again the thermal stress on the board and bga is very high. pop corn effect on bga and also on board either of it cannot be reused. place the thermal sensor very near to the bga, apply flux to the tip of the sensor before placing, use a good quality white light torch to do visual inspection of bga when the temperature reaches 210c once the temp reaches 215c the solder balls should start shining, if you are just reflowing allow the temp extra 3c from the solder balls shining, if you are removing the bga ic allow temp to go extra 4c-5c depending on the requirement and also when the temperature reaches 215c tap all the four corners of x,y table (not on motherboard) very very mildly using a very small metal piece this will release surface tension on the board and bga and while removing bga you can avoid bga pads coming off and avoiding junking the motherboard
Thank you so much replying to my messages. I had the upper heater at 2.5 reading, which I found out that was too close to the board. I am thinking of using 3.5-4 reading now. My aim is to only reflow for now, once I get used to it then maybe I will move to re-balling etc. Is it possible that the bga on green hp boards are also lead soldered. I am under the impression the green boards are lead-free. Can I use clamps to hold the pcb to xy table. Thank you again.
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Old 07-27-2010, 20:22   #20 (permalink)
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Originally Posted by bhartek View Post
Thank you so much. I bought AMTECH flux from Jovy Seller in London. I will use the one you have suggested. I used the profile you mentioned for lead-free & it worked. I think the temperature shown by the Thermal conductor is not correct, it shows lot less. Is there a special way to place the Thermal Coductor on the board. I am thinking of buying IR Thermometer for accurate reading. What do you suggest.
hi. I am using liquid flux, id this ok or flux gel is better. thanks
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Old 08-06-2010, 17:04   #21 (permalink)
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Originally Posted by Raheeeeb View Post
They will do blame you or the machine , My advice is to take time with your machine and read about Dark IR emitters behavior and methodology . It will work great
hI..how much flux should I add/thanks
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Old 08-10-2010, 19:30   #22 (permalink)
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please look profle Jovy RE 7500 Strefa Klienta new profiles soon. I used Flux Jovy or flux Future hF Rework Jelly Warton Metals from UK
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Old 08-11-2010, 16:35   #23 (permalink)
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Paste flux is best to hold down the BGA while reflowing it. But do not use too much. A thin layer is all that is needed. Too much and the BGA will float off the mark.

Liquid flux is mandatory for removing the BGA since its viscosity is adequate for getting under the chip.

Now the key is finding the right flux for the job. Amtech has good paste flux and Ameritech has good liquid flux. Then I use Qualitek for some applications like with preforms. Just make sure you use a flux that is rated for what you are doing. Leaded, lead-free, no-clean, etc. Do some research, the flux is an important element in a successful job.
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