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Go Back   GSM-Forum > GSM & CDMA Phones Hardware Repair Area > Hardware Repair by brands


Hardware Repair by brands All about hardware problems sorted by brands inside subsections.

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Old 01-05-2003, 17:56   #1 (permalink)
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Solder Paste usage ...!!!


How to use solder paste to reball BGA IC ...?
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Old 01-06-2003, 23:49   #2 (permalink)
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You can looking how to use solder paste to reball BGA
http://www.cellular-parts.com/trainningBGA.asp
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Old 01-07-2003, 01:49   #3 (permalink)
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hey
There are two types of reballing kits, one with pre-made solder balls which is shown in that link, and the other one with the grey solder paste which you fill the holes with
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Old 01-07-2003, 06:28   #4 (permalink)
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Thx 4 ur reply ... but

Scaramouche is right ...this totorial is how to place SOLDER BALLS

on BGA ..... i need how to use solder paste to rebll BGA ...any

links ...? OR can and one exlain it here in this forum ...?
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Old 01-07-2003, 06:38   #5 (permalink)
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I have the solder paste kit. Basically, you take the BGA off the phone, clean all the solder pads until they are nice & shiny. You place the BGA in the holder, and you cover it with the stencil. The stencil is a sheet of metal with tiny holes which correspond to the pads on the BGA. So you align this stencil with the holes to the BGA pads. You then take some of the BGA paste, and put it on the stencil. You then use this rubber shovel, to spread the paste into the holes in the stencil, so all the holes are filled with paste. You then **** hot air onto the stencil, and the paste in the holes melts and forms balls on the pad. When it cools, you remove the stencil. You then **** hot air on the balls, to give them better shape & make sure they stick. You use a toothbrush to clean away any flakes of solder between the balls, and thats it!!!

This is VERY frustrating, especially, when you have 63 good balls but 1 ball not formed. You have to clean the BGA, clean the stencil, and start again.
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Old 01-07-2003, 17:12   #6 (permalink)
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Hugs ,,,
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