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Go Back   GSM-Forum > GSM & CDMA Phones / Tablets Software & Hardware Area > iPhone ,iPod & iPad (Apple Inc. Products) > iPhone, iPad, iPod Hardware Repair

iPhone, iPad, iPod Hardware Repair Hardware Repair discussions for iPhone, iPod , iPad & Apple Products, help, guides.

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Old 12-02-2011, 16:54   #1741 (permalink)
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Quote:
Originally Posted by Wites View Post
No that is for GPS after phone will work and you will have GPS problem then you can replace it.
Hey Wites, I removed the PMIC because I noticed a crack on the glue after inspecting at 40X you can take a look in the attachment 1 (it's a bit difficult to see it but if you look in the red box you will notice it.

Now that the PMIC is removed I took a look at the solder pads and I think I just damaged permanently the board, I have another image (refer to attachment 2) what do you think? Shall I try to put new PMIC or it is too damaged the board?
Attached Images
File Type: jpg iPhone 3G more Problems Found.jpg (187.7 KB, 73 views)
File Type: jpg iPhone 3G PMIC solder pads.jpg (574.4 KB, 78 views)
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Old 12-02-2011, 17:55   #1742 (permalink)
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Quote:
Originally Posted by limespirit View Post
Hey Wites, I removed the PMIC because I noticed a crack on the glue after inspecting at 40X you can take a look in the attachment 1 (it's a bit difficult to see it but if you look in the red box you will notice it.

Now that the PMIC is removed I took a look at the solder pads and I think I just damaged permanently the board, I have another image (refer to attachment 2) what do you think? Shall I try to put new PMIC or it is too damaged the board?
Yes crack in glue,but i think pads are not damaged you only need to resolder them with some flux,that is solder removed not damaged.
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Old 12-02-2011, 17:58   #1743 (permalink)
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Originally Posted by Wites View Post
Yes crack in glue,but i think pads are not damaged you only need to resolder them with some flux,that is solder removed not damaged.
So that means that the PMIC might be the problem right?

And can you advise which tracks I need exactly to fill? And with what material? I never repaired tracks before
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Old 12-02-2011, 18:02   #1744 (permalink)
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Originally Posted by limespirit View Post
So that means that the PMIC might be the problem right?

And can you advise which tracks I need exactly to fill? And with what material? I never repaired tracks before
Yes PMIC problem,after i remove some ic i renew solder on each print so it will
make 100% connection,same make to PMIC prints.
I think your PMIC is good,because an ic can't burn after phone dropped.
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Old 12-02-2011, 18:08   #1745 (permalink)
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Quote:
Originally Posted by Wites View Post
Yes PMIC problem,after i remove some ic i renew solder on each print so it will
make 100% connection,same make to PMIC prints.
I think your PMIC is good,because an ic can't burn after phone dropped.
Ok I will reball the solder pads one by one.

So do I just buy a new PMIC? I don't want to resolder the one I just desoldered because of the high heat given to remove it (400C).

So you mean that the phone won't be working after I replace PMIC since it wasn't burned? So what could be the problem then? Why was there the crack in glue is it normal?
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Old 12-02-2011, 18:19   #1746 (permalink)
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Quote:
Originally Posted by limespirit View Post
Ok I will reball the solder pads one by one.

So do I just buy a new PMIC? I don't want to resolder the one I just desoldered because of the high heat given to remove it (400C).

So you mean that the phone won't be working after I replace PMIC since it wasn't burned? So what could be the problem then? Why was there the crack in glue is it normal?
Ok replace it but in future don't use more than 360C or 370C of heat,crack in glue after dropped phone mean that prints between ic and board loose connection,so in this case i make only reball of ic to renew connection how it was.
I m afraid that other ic's can have crack in glue look carefully.
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Old 12-02-2011, 18:43   #1747 (permalink)
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Ok replace it but in future don't use more than 360C or 370C of heat,crack in glue after dropped phone mean that prints between ic and board loose connection,so in this case i make only reball of ic to renew connection how it was.
I m afraid that other ic's can have crack in glue look carefully.
I couldn't remove IC less than 400C thats why I gave that heat with full air flow...I did heating for about 6mins but couldn't melt solder under IC, any tips for the future?

I will check other cracks but didnt see any yesterday.

Thanks
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Old 12-02-2011, 19:10   #1748 (permalink)
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Originally Posted by limespirit View Post
I couldn't remove IC less than 400C thats why I gave that heat with full air flow...I did heating for about 6mins but couldn't melt solder under IC, any tips for the future?

I will check other cracks but didnt see any yesterday.

Thanks
It melts at 360C that is glue holds the ic,and you think it's not melted.
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Old 12-02-2011, 19:14   #1749 (permalink)
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It melts at 360C that is glue holds the ic,and you think it's not melted.
And how much air flow and time you give before the ic can be lifted off?
Because I dont know how to check whether the solder underneath started melting.
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Old 12-02-2011, 19:30   #1750 (permalink)
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iphone 2g power problem

sir plz help me i have a iphone 2g,it is dead when i charged it.it did not show the charging It will only power up for a few seconds when it is plugged up after a few seconds it will dead.then i on it again it show apple icon for few seconds and shatdown again.advance thanks
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Old 12-02-2011, 19:43   #1751 (permalink)
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Quote:
Originally Posted by limespirit View Post
And how much air flow and time you give before the ic can be lifted off?
Because I dont know how to check whether the solder underneath started melting.
I use 360C full air 4 or 5 minutes.
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Old 12-02-2011, 19:44   #1752 (permalink)
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Originally Posted by juttg View Post
sir plz help me i have a iphone 2g,it is dead when i charged it.it did not show the charging It will only power up for a few seconds when it is plugged up after a few seconds it will dead.then i on it again it show apple icon for few seconds and shatdown again.advance thanks
Jump green fuse near battery solder pads,you will have to remove metallic part.
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Old 12-02-2011, 19:47   #1753 (permalink)
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Jump green fuse near battery solder pads,you will have to remove metallic part.
Hey juttg do as wites say check batt fuse...it worked on mine had same issue but on iphone 3g.
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Old 12-02-2011, 19:50   #1754 (permalink)
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I use 360C full air 4 or 5 minutes.
Hey wites thanks for the tip...I bought 2 PMIC today from china guess it will take around 2-3 weeks to arrive or else I will try to remove one from a dead board. So 360C 4-5mins full air is safe no risk of burning PMIC to desolder and solder a PMIC on a new board
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Old 12-02-2011, 21:05   #1755 (permalink)
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Quote:
Originally Posted by limespirit View Post
Hey wites thanks for the tip...I bought 2 PMIC today from china guess it will take around 2-3 weeks to arrive or else I will try to remove one from a dead board. So 360C 4-5mins full air is safe no risk of burning PMIC to desolder and solder a PMIC on a new board
No risk of burn but a risk that with 360C some prints of PMIC will be removed.
Today i needed to reball same PMIC and 1 important print removed from it.
If you unsolder that PMIC and all prints are good reball it and solder back practice a little.
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